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In this paper we compare dry oxidation, at different temperatures and oxidation times, on epitaxial SiGe films and Si reference samples. Rapid and conventional furnaces and several analysis techniques, such as Rutherford backscattering spectrometry, transmission electron microscopy and secondary ion mass spectroscopy, have been used to process and characterize our samples. We focused the attention on the thin oxide regime (3–30 nm), pointing out substantial differences between Si and SiGe in the oxidation kinetics and point defect injection. In fact, SiGe films show an oxidation rate enhancement with respect to Si, previously reported by other groups only for wet ambient. The enhancement, however, decreases with temperature and oxide thickness. From our data we estimated the activation energies for Si and SiGe oxidation in our range of thickness. We also show that Ge segregates behind the oxide …
Publication date: 
1 Feb 2005

M Spadafora, A Terrasi, S Mirabella, A Piro, MG Grimaldi, S Scalese, E Napolitani, M Di Marino, D De Salvador, A Carnera

Biblio References: 
Volume: 8 Issue: 1-3 Pages: 219-224
Materials science in semiconductor processing